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        <title>Why AI Chips Made In The U.S. Are Being Sent To Taiwan — Creating A Major Bottleneck</title>
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        <description>There's a new bottleneck in the AI chipmaking process that happens almost entirely in Asia right now: advanced packaging. It connects smaller chips together into a larger chip like a GPU, so it can communicate with data centers and more. As Nvidia books the majority of capacity, TSMC prepares to break ground on its first U.S. packaging plants, and Elon Musk taps Intel for ambitious custom chip plans in Texas. CNBC got an exclusive interview with TSMC and toured an Intel packaging plant in Arizona to find out exactly how advanced packaging works and why capacity is ramping up fast. 00:00 - Introduction 2:25 - Rise of advanced packaging 5:57 - From 2D to 3D 10:39 - U.S. packaging capacity Produced and Shot by: Katie Tarasov Edited by: Evan Lee Miller Camera by: Marc Ganley, Tony Puyol Senior Director of Video: Jeniece Pettitt Animation: Jason Reginato, Emily Park » Subscribe to CNBC: https://cnb.cx/SubscribeCNBC » Subscribe to CNBC TV: https://cnb.cx/SubscribeCNBCtelevision About CNBC: From 'Wall Street' to 'Main Street' to award winning original documentaries and Reality TV series, CNBC has you covered. Experience special sneak peeks of your favorite shows, exclusive video and more. Want to get ahead at work with AI? Sign up for CNBC's new online course, Beyond the Basics: How to Use AI to Supercharge Your Work. Learn advanced AI skills like building custom GPTs and using AI agents to boost your productivity today. Sign up today: https://cnb.cx/4qKBe6H Connect with CNBC News Online Get the latest news: https://www.cnbc.com/ Follow CNBC on LinkedIn: https://cnb.cx/LinkedInCNBC Follow CNBC News on Instagram: https://cnb.cx/InstagramCNBC Follow CNBC News on Facebook: https://cnb.cx/LikeCNBC Follow CNBC on Threads: https://cnb.cx/threads Follow CNBC News on X: https://cnb.cx/FollowCNBC Follow CNBC on WhatsApp: https://cnb.cx/WhatsAppCNBC #CNBC Nvidia Booked The Majority Of TSMC’s Capacity Of A Crucial Chipmaking Step</description>
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